NX3P191UK012/DESTRUCT UNITS
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43451299-NX3P191UK012/DESTRUCT UNITS
Logic Controlled High-Side Power Switch 1.1V to 3.6V 4-Pin WLCSP Surface Mount
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
Output formats are used to determine which data is exported and how data is displayed in many areas of OLIB.
a particular group of related products.