LFDAK1T

NXP LFDAK1T

Part No:

LFDAK1T

Manufacturer:

NXP

Datasheet:

-

Package:

292-HBGA

AINNX NO:

35829447-LFDAK1T

Category:

Accessories

Description:

QFP ZIF Socket Adapter 0.635mm Pitch 132-Pin

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    292-HBGA
  • Supplier Device Package
    292-BGA
  • Number of I/Os
    169
  • RoHS
    Compliant
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C
  • Series
    --
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Applications
    Multimedia
  • Voltage - Supply
    2.375 V ~ 2.625 V
  • Base Part Number
    PNX13*
  • Interface
    I²C, 2-Wire Serial
  • RAM Size
    48K x 8
  • Core Processor
    TriMedia™
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    --
  • Controller Series
    Nexperia
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