NXP BLF573

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

3

Number of Terminals

2

Transistor Element Material

SILICON

Package

Bulk

Mfr

PEI-Genesis

Product Status

Active

RoHS

Compliant

Package Description

FLANGE MOUNT, R-CDFM-F2

Package Style

FLANGE MOUNT

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

225 °C

Rohs Code

Yes

Manufacturer Part Number

BLF573

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.62

Drain Current-Max (ID)

42 A

Series

*

ECCN Code

EAR99

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

225 °C

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

SOURCE

Transistor Application

AMPLIFIER

Drain to Source Voltage (Vdss)

50 V

Polarity/Channel Type

N-CHANNEL

Continuous Drain Current (ID)

42 A

DS Breakdown Voltage-Min

110 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band

VERY HIGH FREQUENCY BAND

REACH SVHC

No SVHC