NXP BFX85

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

RoHS

Compliant

Package Description

CYLINDRICAL, O-MBCY-W3

Package Style

CYLINDRICAL

Package Body Material

METAL

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

175 °C

Rohs Code

No

Transition Frequency-Nom (fT)

185 MHz

Manufacturer Part Number

BFX85

Package Shape

ROUND

Manufacturer

TT Electronics Power and Hybrid / Semelab Limited

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

SEMELAB LTD

Risk Rank

5.21

Part Package Code

BCY

Pbfree Code

No

ECCN Code

EAR99

Number of Positions

240

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.21.00.75

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

O-MBCY-W3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Transistor Application

SWITCHING

Polarity/Channel Type

NPN

JEDEC-95 Code

TO-205AD

Collector Current-Max (IC)

1 A

DC Current Gain-Min (hFE)

15

Collector-Emitter Voltage-Max

60 V