NXP BFW30

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

RoHS

Non-Compliant

Package Description

,

Operating Temperature-Max

200 °C

Rohs Code

No

Manufacturer Part Number

BFW30

Manufacturer

North American Philips Discrete Products Div

Part Life Cycle Code

Transferred

Ihs Manufacturer

NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV

Risk Rank

5.67

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Subcategory

Other Transistors

Reach Compliance Code

unknown

Configuration

Single

Polarity/Channel Type

NPN

Power Dissipation-Max (Abs)

0.25 W

Collector Current-Max (IC)

0.05 A

DC Current Gain-Min (hFE)

25