NXP BCF30

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Package Description

,

Operating Temperature-Max

175 °C

Rohs Code

No

Manufacturer Part Number

BCF30

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Risk Rank

5.58

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Subcategory

Other Transistors

Reach Compliance Code

unknown

Configuration

Single

Polarity/Channel Type

PNP

Power Dissipation-Max (Abs)

0.35 W

Collector Current-Max (IC)

0.2 A

DC Current Gain-Min (hFE)

215