NXP 74LVC827APW

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

24

Package Description

TSSOP, TSSOP24,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP24,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

No

Manufacturer Part Number

74LVC827APW

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

PHILIPS SEMICONDUCTORS

Risk Rank

8.07

Prop.

7 ns

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Subcategory

Bus Driver/Transceivers

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.635 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G24

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3.3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Number of Bits

10

Output Characteristics

3-STATE

Output Polarity

TRUE

Logic IC Type

BUS DRIVER

Max I(ol)

0.024 A

Control Type

ENABLE LOW