nVent Hoffman AB2802393901

Series

H3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pitch

0.197 (5.00mm)

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

12-28 AWG

Voltage

300V

Number of Levels

1

Current

10A

Positions Per Level

7

Mating Orientation

45° (135°) Angle with Board