NTE Electronics, Inc. 04-0750PM0

Mounting Type

Push Mount, Arrowhead

Material

Nylon

Body Material

Nylon

Package Quantity

1

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

3926.90.99.85

Automotive

No

PPAP

No

Maximum Bundle Diameter (mm)

50

Product Depth (mm)

4.8

Manufacturer Part Number

04-0750PM0

Manufacturer

NTE Electronics

Package

Bag

Mfr

NTE Electronics, Inc

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bag

Series

-

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Push Mount

Color

Black

Style

Push Mount

Shelf Life

-

Storage/Refrigeration Temperature

-

Shelf Life Start

-

Wire/Cable Tie Type

Standard, Pinch Releasable

Bundle Diameter

The overall diameter required to fit the bundle in an existing shell or tank.

1.97 (50.00mm)

Product Length (mm)

203

Width

0.189 (4.80mm)

Height (in)

0.189

Length - Approximate

8

Length - Actual

0.666 (203.00mm, 7.99)

Product Height (mm)

1.57