RP605Z363B-E2-F

Nisshinbo Micro Devices Inc. RP605Z363B-E2-F

Part No:

RP605Z363B-E2-F

Datasheet:

rp605-ea.pdf

Package:

20-XFBGA, WLCSP

AINNX NO:

68773021-RP605Z363B-E2-F

Description:

300MA ULTRA-LOW POWER BUCK BOOST

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    20-XFBGA, WLCSP
  • Supplier Device Package
    20-WLCSP-P3 (2.32x1.71)
  • Base Product Number
    RP605
  • Series
    RP605x
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Applications
    Battery Management, Power Supplies
  • Voltage - Supply
    1.8V ~ 5.5V
  • Current - Supply
    300nA
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