NJG1682MD7-TE1
-
33032718-NJG1682MD7-TE1
RF Switch ICs GaAs SP3T Switch MMIC High Pwr
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
NJG1522KB2-TE1
NisshinboRF Switch ICs SPDT SwitchNJG1523KB2-TE2
NisshinboRF Switch ICs SPDT SwitchNJG1523KB2-TE1
NisshinboRF Switch ICs SPDTNJG1602HE3-TE1
NisshinboRF Switch ICs DPDT SwitchNJG1522KB2-TE2
NisshinboRF Switch ICs SPDT SwitchNJG1617K11-TE1
NisshinboRF Switch ICs DPDT Switch for Wireless LANNJG1818K75-TE1
NisshinboRF Switch ICsNJG1730MD7-TE1
NisshinboRF Switch ICs 2.4GHz Band SP3T 3.6V LNA GaAs MMICNJG1699MD7-TE1
NisshinboRF Switch ICs GaAs SP4T MMIC 2.7Vdd 1.8V 50dBNJG1660HA8-TE1
NisshinboRF Switch ICs SPDT Switch GaAs MMIC 30dBm 8.0GHz