ELXY100ETD331MH12D

Nippon-Chemi-Con ELXY100ETD331MH12D

Part No:

ELXY100ETD331MH12D

Manufacturer:

Nippon-Chemi-Con

Datasheet:

-

Package:

119-BGA

AINNX NO:

39712284-ELXY100ETD331MH12D

Description:

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    119-BGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Terminal Shape
    WIRE
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    THROUGH HOLE MOUNT
  • Supplier Device Package
    119-PBGA (14x22)
  • Dielectric Material

    a substance that is a poor conductor of electricity, but an efficient supporter of electrostatic field s.

    ALUMINUM (WET)
  • Number of Terminals
    2
  • Memory Types
    Volatile
  • Package Description
    RADIAL LEADED
  • Package Style
    Radial
  • Operating Temperature-Min
    -55 °C
  • Operating Temperature-Max
    105 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    ELXY100ETD331MH12D
  • Package Shape
    CYLINDRICAL PACKAGE
  • Manufacturer
    Nippon Chemi-con Corporation
  • Risk Rank
    5.3
  • Ihs Manufacturer
    NIPPON CHEMI-CON CORP
  • Part Life Cycle Code
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Series
    --
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code
    e6
  • Pbfree Code
    Yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Bismuth (Sn/Bi)
  • Capacitance
    330 µF
  • Packing Method
    TAPE
  • Technology
    SRAM - Synchronous ZBT
  • Voltage - Supply
    3.135 V ~ 3.465 V
  • Terminal Pitch

    The center distance from one pole to the next.

    3.5 mm
  • Reach Compliance Code
    compliant
  • Base Part Number
    IDT71V65803
  • Capacitor Type
    ALUMINUM ELECTROLYTIC CAPACITOR
  • Polarity
    POLARIZED
  • Rated (DC) Voltage (URdc)
    10 V
  • Leakage Current
    0.033 mA
  • Ripple Current

    the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

    445 mA
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    9Mb (512K x 18)
  • Tan Delta
    0.19
  • Clock Frequency
    100MHz
  • Positive Tolerance
    20%
  • Negative Tolerance
    20%
  • Access Time
    5ns
  • Memory Format
    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page
    --
  • Length
    12 mm
  • Diameter
    8 mm
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