ELXY100ETD331MH12D
119-BGA
39712284-ELXY100ETD331MH12D
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.
a substance that is a poor conductor of electricity, but an efficient supporter of electrostatic field s.
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The center distance from one pole to the next.
the pulsed current consumption of non-linear devices like capacitor-input rectifiers.
The memory capacity is the amount of data a device can store at any given time in its memory.
An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.