NIC Components NCB0402P221TR010F

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.