Nexperia USA Inc. PMEG2005EGWX

Factory Lead Time

4 Weeks

Mounting Type

Surface Mount

Package / Case

SOD-123

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Elements

1

Operating Temperature (Max.)

150°C

Power Dissipation (Max)

0.4W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

Automotive, AEC-Q101

Published

2016

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reference Standard

AEC-Q101; IEC-60134

JESD-30 Code

R-PDSO-G2

Configuration

SINGLE

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

200μA @ 20V

Voltage - Forward (Vf) (Max) @ If

390mV @ 500mA

Forward Current

Current which flows upon application of forward voltage.

500mA

Operating Temperature - Junction

150°C Max

Output Current-Max

0.5A

Voltage - DC Reverse (Vr) (Max)

20V

Rep Pk Reverse Voltage-Max

20V

Capacitance @ Vr, F

66pF @ 1V 1MHz

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant