Nexperia MPC855TZQ50D4

EU RoHS

Not Compliant

ECCN (US)

3A991.a.2

HTS

8542.31.00.01

SVHC

Yes

SVHC Exceeds Threshold

Yes

Automotive

No

PPAP

No

Family Name

PowerQUICC MPC8xx Processor

Instruction Set Architecture

RISC

Number of CPU Cores

1

Data Bus Width (bit)

32

Instruction Cache Size

4KB

On-Chip Memory

8KB/RAM

Maximum Speed (MHz)

50

Interface Type

I2C/SPI/UART

UART

1

USART

0

Data Cache Size

4KB

Multiply Accumulate

No

I2C

1

I2S

0

Ethernet Speed

10Mbps/100Mbps

Minimum Operating Supply Voltage (V)

2|3.135

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

3.465|3.6

Maximum Power Dissipation (mW)

735

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Mounting

Surface Mount

Package Height

1.82(Max)

Package Width

25

Package Length

25

PCB changed

357

Standard Package Name

BGA

Supplier Package

BGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

357

Ethernet

0

USB

0

SPI

1

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

MPC8xx