Nexperia MPC8247CVRMIBA

EU RoHS

Compliant

ECCN (US)

3A991.a.2

HTS

8542.31.00.01

Automotive

No

PPAP

No

Family Name

PowerQUICC II MPC82xx Processor

Instruction Set Architecture

RISC

Number of CPU Cores

1

Data Bus Width (bit)

32

Instruction Cache Size

16KB

Maximum Speed (MHz)

266

Interface Type

Ethernet/I2C/SPI/UART/USB

UART

1

USART

0

Data Cache Size

16KB

Multiply Accumulate

No

I2C

1

I2S

0

Ethernet Interface Type

MII/RMII

Ethernet Speed

10Mbps/100Mbps

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

I/O Voltage (V)

3.3

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Mounting

Surface Mount

Package Height

1.95(Max)

Package Width

27

Package Length

27

PCB changed

516

Standard Package Name

BGA

Supplier Package

TEBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

Pin Count

a count of all of the component leads (or pins)

516

Core Architecture

603e

Ethernet

2

USB

1

SPI

1

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

PowerPC