Nexperia GRM155B31C105KA12D

Package / Case

0402

Number of Terminals

2

Product Weight (g)

0.0016

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8532.24.00.20

Automotive

No

PPAP

No

Capacitance Value

1uF

Microwave Application

No

Mounting

Surface Mount

Case Style

Ceramic Chip

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Product Depth (mm)

0.5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Construction

Flat

Termination Style

Pad

Dielectric

B

Voltage

16VDC

Size(mm)

1 X 0.5 X 0.5

Product Length (mm)

1

Product Height (mm)

0.5