Nexperia BGA2800，115

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Tolerance

5 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

200 ppm/°C

Resistance

43 kΩ

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

155 °C

Min Operating Temperature

-55 °C

Composition

Thick Film

Power Rating

500 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

500 mW

Features

Automotive AEC-Q200

Width

1.2446 mm

Height

609.6 µm

Length

2.0066 mm

Lead Free

Lead Free