ECCN (US)
EAR99
Number of Elements per Chip
1
Number of Channels per Chip
8
Latch Mode
Addressable
Logic Family
AHC
Set/Reset
Master Reset
Bus Hold
No
Number of Output Enables per Element
0
Number of Outputs per Chip
8
Number of Selection Inputs per Element
3
Number of Input Enables per Element
1
Number of Inputs per Chip
1
Mounting
Surface Mount
Supplier Package
TSSOP
Maximum Operating Temperature (°C)
125
Minimum Operating Temperature (°C)
-40
Propagation Delay Test Condition (pF)
50
Maximum Quiescent Current (uA)
4
Maximum Operating Supply Voltage (V)
5.5
Typical Operating Supply Voltage (V)
5
Minimum Operating Supply Voltage (V)
2
Maximum High Level Output Current (mA)
-8
Maximum Low Level Output Current (mA)
8
Process Technology
CMOS
Absolute Propagation Delay Time (ns)
23
Maximum Propagation Delay Time @ Maximum CL (ns)
PCB changed
16
Package Width
4.5(Max)
Package Length
5.1(Max)
Package Height
0.95(Max)
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape and Reel
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete
Type
D-Type
Pin Count
a count of all of the component leads (or pins)
16
Polarity
Non-Inverting
RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
Supplier Unconfirmed