NEC UPB1506GV

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

Package Description

0.175 INCH, PLASTIC, SSOP-8

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

10

Operating Temperature-Max

85 °C

Manufacturer Part Number

UPB1506GV

Supply Voltage-Nom (Vsup)

5 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

NEC Compound Semiconductor Devices Ltd

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NEC COMPOUND SEMICONDUCTOR DEVICES LTD

Risk Rank

5.37

Technology

BIPOLAR

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.65 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G8

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

5.5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

4.5 V

Family

UPB15

Seated Height-Max

1.8 mm

Logic IC Type

PRESCALER

fmax-Min

3000 MHz

Number of Data/Clock Inputs

1

Length

3.2 mm