National Semiconductor V62/04660-01YE

Number of Input Enables per Element

0

Operating Temperature (Max.)

125C

Operating Temperature Classification

Automotive

Package Type

TSSOP

Logical Function

Mux

Maximum Propagation Delay Time @ Maximum CL

[email protected]/[email protected]

Logic Family

LVC

Operating Temp Range

-40C to 125C

Output Signal Type

SINGLE-ENDED

Number of Elements

1

Process Technology

CMOS

Operating Supply Voltage (Max)

3.6(V)

Operating Supply Voltage (Typ)

2.5/3.3(V)

Rad Hardened

No

Tolerant I/Os

5

Number of Output Enables per Element

1

Number of Selection Inputs per Element

1

Operating Supply Voltage (Min)

2(V)

Input Signal Type

Single-Ended

Parity Invert Input

NO

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Pin Count

a count of all of the component leads (or pins)

16

Number of Outputs

4

Output Type

3-State

Polarity

Non-Inverting

Configuration

4 x 2:1

Number of Inputs

8

High Level Output Current

High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

-24(mA)

Low Level Output Current

The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

24(mA)

Quiescent Current (Max)

0.01(mA)