National Semiconductor TMS320DM648ZUTD9

Operating Temperature (Max.)

90C

Device Input Clock Speed

900(MHz)

Clock Freq

900(MHz)

Device Million Instructions per Second

7200(MIPS)

Operating Temperature Classification

Industrial

Package Type

FCBGA

Operating Temp Range

-40C to 90C

Device Core Size

32(b)

Operating Supply Voltage (Max)

1.26(V)

Operating Supply Voltage (Typ)

1.2(V)

Rad Hardened

No

Operating Supply Voltage (Min)

1.14(V)

Operating Temperature (Min.)

-40C

Programmable

Yes

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Pin Count

a count of all of the component leads (or pins)

529

Program Memory Size

64KB(kB)

Architecture

Advanced VLIW

Format

Fixed Point