LM555CJ

National Semiconductor LM555CJ

Part No:

LM555CJ

Datasheet:

-

Package:

-

AINNX NO:

17655917-LM555CJ

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Operating Temperature (Max.)
    70°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • JESD-609 Code
    e0
  • Number of Terminations
    8
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • JESD-30 Code
    R-XDIP-T8
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5/15V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free
    Contains Lead
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