National Semiconductor HPC46003V20/NOPB

Mounting Type

Surface Mount

Package / Case

68-LCC (J-Lead)

Supplier Device Package

68-PLCC (25.13x25.13)

Operating Temperature (Max.)

70C

Instruction Set Architecture

CISC

Clock Freq

20(MHz)

Operating Temperature Classification

COMMERCIALC

Package Type

PLCC

Number of Timers - General Purpose

8

Operating Temp Range

0C to 70C

# I/Os (Max)

52

Interface Type

UART

Total Internal Ram Size

256B(kB)

Frequency(Max)

30 MHz

Device Core Size

16(b)

Operating Supply Voltage (Max)

5.5(V)

Operating Supply Voltage (Typ)

5(V)

Rad Hardened

No

Operating Supply Voltage (Min)

4.5(V)

Operating Temperature (Min.)

0C

Programmable

Yes

Maximum Expanded Memory Size

64KB

Mounting

Surface Mount

Number of I/Os

52

Package

Tube

Base Product Number

HPC46003

Mfr

National Semiconductor

Data Converters

-

Product Status

Obsolete

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Rail/Tube

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 70°C (TA)

Series

HPC™

Frequency

20(MHz)

Pin Count

a count of all of the component leads (or pins)

68

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

External

Speed

20MHz

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Core Processor

HPC

Peripherals

PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROM

Core Size

16-Bit

Program Memory Size

8KB(kB)

Connectivity

Microwire/Plus (SPI), UART/USART

EEPROM Size

-

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

HPC