National Semiconductor DS1100M-75

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

8

Package Description

DIP,

Package Style

IN-LINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

20

Operating Temperature-Max

85 °C

Output Impedance-Nom (Z0)

50 Ω

Rohs Code

No

Manufacturer Part Number

DS1100M-75

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS INC

Risk Rank

5.11

Part Package Code

DIP

JESD-609 Code

e0

Pbfree Code

No

Terminal Finish

TIN LEAD

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

240

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDIP-T8

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Supply Voltage-Max (Vsup)

5.25 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

4.75 V

Seated Height-Max

4.572 mm

Output Polarity

TRUE

Logic IC Type

SILICON DELAY LINE

Number of Taps/Steps

5

Programmable Delay Line

NO

Total Delay-Nom (td)

75 ns

Width

7.62 mm

Length

9.375 mm