Murata PVC6H254C01B00

Mount

Through Hole

Weight

500 mg

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

10 %

Termination

PC Pin

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

100 ppm/°C

Resistance

250 kΩ

Composition

Ceramic

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

500 mW

Width

6.5024 mm

Height

8.001 mm

Length

6.9088 mm

Lead Free

Lead Free