Multicomp SMAJ33A-13-F

Package / Case

7360-20

Operating Temperature Max Deg. C

105C

Product Depth (mm)

6(mm)

DF

10%

Operating Temp Range

-55C to 105C

Case Style

Molded

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Length W/Weld

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

DCL

352(uA)

Operating Temperature Min Deg. C

-55C

Seal

Not Required

Operating Temperature Classification

Military

Package Type

SMA

Reverse Stand-off Voltage

33(V)

Peak Pulse Power Dissipation

400(W)

Number of Elements

1

Rad Hardened

No

Test Current (It)

1(mA)

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

220UF(pF)

Construction

SMT Chip

Pin Count

a count of all of the component leads (or pins)

2

Termination Style

Not Required

Polarity

Polar

Voltage

16VDC

Clamping Voltage

53.3(V)

Peak Pulse Current

The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

5.6(A)

Insulation

Not Required

ESR

0.07(ohm)

Reverse Breakdown Voltage

36.7(V)

Leakage Current (Max)

0.005(uA)

Product Length (mm)

7.3(mm)

Product Height (mm)

2(mm)