Multicomp MCU0603C102JCT

Package / Case

Not Required

Lead Spacing (nom)

7.5(mm)

Product Depth (mm)

5(mm)

Wire Form

Straight

Operating Temp Range

-40C to 125C

Product Diameter (mm)

8(mm)

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

N750

Lead Diameter (nom)

0.6(mm)

Suppression Class

X1/Y2

Tolerance (+ or -)

20%

Rad Hardened

No

Seated Plane Height

11(mm)

MSL

-

Qualification

-

Capacitance Tolerance

± 5%

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Ceramic Disc

Capacitance

47PF(pF)

Construction

Radial

Termination Style

Radial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

440VAC/300VAC

Size(mm)

8 X 5

Product Length

1.6mm

Product Width

0.85mm

Product Length (mm)

Not Required(mm)

Product Height (mm)

Not Required(mm)