Multicomp BSS138W-7-F

Package / Case

Not Required

Lead Spacing (nom)

27.5 mm

Product Depth (mm)

11 mm

Operating Temp Range

-55C to 100C

Product Diameter (mm)

Not Required mm

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

PET

Lead Diameter (nom)

0.8 mm

Tolerance (+ or -)

10%

Rad Hardened

No

Seated Plane Height

21 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Capacitance

2200000 pF

Construction

Radial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

250VDC/160VAC

Size(mm)

31 X 11 X 21

Product Length (mm)

31 mm

Product Height (mm)

21 mm