Multicomp BAV99W-7-F

Package / Case

3528-21

Operating Temperature Max Deg. C

105C

Lead Spacing (nom)

Not Required(mm)

Product Depth (mm)

2.8(mm)

DF

8%

Wire Form

Not Required

Operating Temp Range

-55C to 105C

Case Style

Molded

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Surface Mount

Length W/Weld

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

20%

DCL

42.8(uA)

Operating Temperature Min Deg. C

-55C

Seal

Not Required

Rad Hardened

No

Seated Plane Height

Not Required(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Capacitance

68UF(pF)

Construction

SMT Chip

Termination Style

Not Required

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Polarity

Polar

Voltage

6.3VDC

Insulation

Not Required

ESR

0.07(ohm)

Case Code

B

Product Length (mm)

3.5(mm)

Product Height (mm)

1.9(mm)