Multicomp 029-1012

Package / Case

Not Required

Lead Spacing (nom)

7.5(mm)

Product Depth (mm)

4(mm)

Operating Temp Range

-30C to 125C

Product Diameter (mm)

13.5(mm)

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

Y5P

Lead Diameter (nom)

0.6(mm)

Tolerance (+ or -)

10%

Rad Hardened

No

Seated Plane Height

18.3(mm)

For Use With

8mm Leader Tapes

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Ceramic Disc

Capacitance

4700(pF)

Construction

Radial

Termination Style

Radial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

1000VDC

Accessory Type

8mm Tape Extenders

Size(mm)

13.5 X 4

Product Length (mm)

Not Required(mm)

Product Height (mm)

Not Required(mm)