Motorola Semiconductor Products MPX4250DP

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

THROUGH HOLE MOUNT

Type of enclosure

multipurpose

Dimension X

143mm

Dimension Y

208mm

Dimension Z

51mm

Enclosure series

PFG

Enclosure material

ABS

Body colour

white

Side colour

emerald

Part Life Cycle Code

Transferred

Ihs Manufacturer

MOTOROLA INC

Package Description

PLASTIC, UNIBODY PACKAGE-6

Accuracy-Max (%)

1.4%

Linearity (%)

1.4 %

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Supply Voltage-Max

5.35 V

Supply Voltage-Min

4.85 V

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

TEMPERATURE COMPENSATED, SIGNAL CONDITIONED

Reach Compliance Code

unknown

Body Length or Diameter

29.46 mm

Body Breadth

10.67 mm

Output Type

ANALOG VOLTAGE

Termination Type

SOLDER

Response Time

the time taken for a circuit or measuring device, when subjected to a change in input signal, to change its state by a specified fraction of its total response to that change.

1000 μs

Sensors/Transducers Type

PRESSURE SENSOR,PIEZORESISTIVE

Housing

PLASTIC

Pressure Range-Max

36.25 Psi

Output Range

0.20-4.90V

Pressure Sensing Mode

DIFFERENTIAL

Operating Current-Max

10 mA

Offset-Nom

0.20V

Port Type

an abstract set of operations supported by one or more endpoints.

BARBED

Body Height

28.7 mm