Motorola Semiconductor Products MMBV3700LT1

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

synthetic polyolefin

Diode Element Material

SILICON

Number of Terminals

3

Exterior Housing Material

1

Rohs Code

No

Part Life Cycle Code

Transferred

Ihs Manufacturer

MOTOROLA INC

Package Description

R-PDSO-G3

Operating Temperature-Max

125 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Diameter of protected wire (cable)

55…95 mm

Diameter before shrinkage

100 mm

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

in 1m cut lengths

JESD-609 Code

e0

ECCN Code

EAR99

Type

Non-adhesive heat shrink tube

Terminal Finish

Tin/Lead (Sn/Pb)

Color

blue

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.10.00.80

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Diode Type

PIN DIODE

JEDEC-95 Code

TO-236AB

Breakdown Voltage-Min

200 V

Reverse Test Voltage

20 V

2nd Connector Number of Positions Loaded

SWITCHING

Frequency Band

VERY HIGH FREQUENCY

Diode Capacitance-Nom

1 pF

Diode Capacitance-Max

1 pF

Diode Res Test Current

10 mA

Diode Forward Resistance-Max

1 Ω

Shrink Ratio

2 : 1