Molex 505418-1291

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Termination Method

Solder

Body Orientation

Right Angle

Maximum Current Rating (A)

0.5/Contact

Maximum Voltage Rating

10VAC|10VDC

Insulation Resistance (MOhm)

1000

Maximum Contact Resistance (mOhm)

150

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Mating Cycle (Cycles)

2000

Product Depth (mm)

32.06

Mounting

Surface Mount

Voltage Rating Max

10VDC/10VAC

Number of Contact Rows

2

Operating Temp Range

-25C to 85C

Mounting Styles

Surface Mount

Contact Materials

Copper Alloy

Rad Hardened

No

Ejector Type

Right Button

Package

Bulk

Mfr

Molex

Product Status

Active

Rohs Code

Yes

Manufacturer Part Number

505418-1291

Manufacturer

Molex

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOLEX LLC

Risk Rank

5.8

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

*

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Micro SIM Card

Number of Rows

2

Gender

M

Reach Compliance Code

compliant

Number of Contacts

12

Current Rating (Max)

0.5/Contact(A)

Terminal Plating

Gold

Product Length (mm)

16.5

Product Height (mm)

1.95