Molex 5030P1B09M020

RoHS

Non-Compliant

Manufacturer Part Number

5030P1B09M020

Manufacturer

Molex

Part Life Cycle Code

Active

Ihs Manufacturer

MOLEX LLC

Risk Rank

5.66

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Tolerance

0.1 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

25 ppm/°C

Connector Type

CIRCULAR CONNECTOR

Resistance

2.77 kΩ

Composition

Metal Film

Power Rating

125 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

125 mW

Reach Compliance Code

unknown

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

0.001 %

Features

Military, Moisture Resistant, Weldable

Width

2.39 mm

Length

6.35 mm

Lead Free

Contains Lead