Molex 3081

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Silver

Body Orientation

Right Angle

Product Depth (mm)

36.5(mm)

Shell Size / Insert Arrangement

18-25

Operating Temp Range

-55C to 125C

Termination Method

Crimp

Product Diameter (mm)

36.5(mm)

Mounting Styles

Cable

Contact Materials

Copper Alloy

Rad Hardened

No

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Type

Circular

Gender

PL

Contact Gender

PIN

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1(Port)

Family

AC

Strain Relief

No

Product Height (mm)

53.25(mm)