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Molex 19028-0050
Part No:
19028-0050
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
33963648-19028-0050
Category:
Description:
Insulation Punch (Upper) for ACP press that process continuous molded product
Products specifications
- Lifecycle StatusObsolete (Last Updated: 2 years ago)
- Country of OriginUS
- Manufacturer Lifecycle StatusOBSOLETE (Last Updated: 2 years ago)
- RoHSNon-Compliant
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
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