Molex 1719820142

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount, Right Angle

Shell Material

STAINLESS STEEL

Mounting Option 1

LOCKING

Board Mounting Option

PEG

Contact Materials

COPPER ALLOY

Insulation Materials

GLASS FILLED THERMOPLASTIC

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

171982

Published

2015

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

Nano-Pitch I/O

Number of Positions

42

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8536.69.40.30

Total Number of Contacts

42

Terminal Pitch

The center distance from one pole to the next.

0.508mm

Shell Finish

TIN OVER NICKEL

Number of Conductors

ONE

Reference Standard

UL

Contact Finish

Gold

Reliability

COMMERCIAL

Body Length or Diameter

0.53 inch

Number Of PCB Rows

2

PCB Contact Pattern

RECTANGULAR

Body Breadth

0.156 inch

Contact Gender

FEMALE

Body Depth

0.354 inch

Contact Style

BELLOWED TYPE

Polarization Key

POLARIZED HOUSING

Connector Style

Receptacle

PCB Contact Row Spacing

2.1844 mm

Features

Board Guide, Solder Retention

Contact Finish Thickness

30.0μin 0.76μm

Plating Thickness

30μin

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant