Molex 1051420132

Factory Lead Time

9 Weeks

Mounting Type

Surface Mount

Housing Material

Thermoplastic

Number of Positions or Pins (Grid)

2011 (47 x 58)

Contact Material - Mating

Copper Alloy

Contact Finish Mating

Gold

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

105142

Published

2012

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Last Time Buy

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Type

LGA

Reach Compliance Code

unknown

Pitch - Mating

0.040 1.02mm

Pitch - Post

0.040 1.01mm

Features

Open Frame

Contact Finish Thickness - Mating

15.0μin 0.38μm

Material Flammability Rating

UL94 V-0

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant