Mitsubishi Materials U.S.A. Corporation FA55-272-A22F-M

Factory Lead Time

8 Weeks

Mounting Type

Through Hole

Package / Case

Axial Cylinder

Impulse Discharge Current (8/20µs)

2500A 2.5kA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

FA55

Tolerance

±20%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Number of Poles

2

Fail Short

No

Voltage - DC Spark Over (Nom)

2700V