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50-02-1038-0000
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67549693-50-02-1038-0000
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CHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics CHO BOND� 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding.
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Miscellaneous ProductsCHO-BOND 1038 Silver-Plated Copper Filled Silicone Electrically Conductive Sealant. Parker Chomerics CHO BOND� 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding.