Mill-Max Manufacturing Corp. 342-40-108-00-592000

Factory Lead Time

3 Weeks

Mounting Type

Through Hole

Housing Material

Polychlorinated

Contact Materials

Brass

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

342

Published

2013

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Termination

Solder

ECCN Code

EAR99

Number of Positions

8

Color

Black

Number of Rows

1

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SOCKET HEADER

Pitch

0.100 2.54mm

Orientation

Straight

Depth

2.54mm

Number of Contacts

8

Contact Finish - Post (Mating)

Tin

Max Voltage Rating (AC)

100V

Max Voltage Rating (DC)

150V

Device Socket Type

IC SOCKET

Length

20.32mm

Length - Stack Height

0.335 8.500mm

Length - Overall Pin

0.585 14.859mm

Length - Post (Mating)

0.125 3.180mm

Contact Finish Thickness - Post (Mating)

200.0μin 5.08μm

Length - Tail

0.125 3.180mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free