Mill-Max Manufacturing Corp. 3360-1-14-80-00-00-08-0

Factory Lead Time

5 Weeks

Mount

Through Hole

Number of Positions or Pins (Grid)

2 (1 x 2)

Contact Materials

Brass

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

3360

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Non-Insulated

Number of Rows

1

Gender

Male Pins

Pitch

0.200 5.08mm

Orientation

Straight

Depth

630μm

Contact Finish

Tin

Height

0.200 5.08mm

Length

5.08mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant