Micross JANS1N4483

Mounting Type

Surface Mount

Package / Case

TO-252-3, DPak (2 Leads + Tab), SC-63

Supplier Device Package

DPAK

Current - Average Rectified (Io) (per Diode)

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Series

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

1mA @ 150V

Voltage - Forward (Vf) (Max) @ If

890mV @ 6A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

150V

Diode Configuration

1 Pair Common Cathode