Micross 1N5809

Mounting Type

Through Hole

Package / Case

DO-204AC, DO-15, Axial

Supplier Device Package

DO-204AC (DO-15)

Series

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Base Part Number

BY133

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 1300V

Voltage - Forward (Vf) (Max) @ If

1.2V @ 2A

Operating Temperature - Junction

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Voltage - DC Reverse (Vr) (Max)

1300V

Current - Average Rectified (Io)

1A

Capacitance @ Vr, F

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Reverse Recovery Time (trr)

2µs