Microsemi ZARLINK ZL30107GGG

Package / Case

Axial

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

Axial

Number of Terminals

64

Package Description

BGA,

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

ZL30107GGG

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

Active

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.65

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 155°C

Series

RNF

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Size / Dimension

0.093 Dia x 0.250 L (2.35mm x 6.35mm)

Tolerance

±1%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±100ppm/°C

Resistance

1.24 kOhms

Composition

Metal Film

Power (Watts)

0.25W, 1/4W

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B64

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

--

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Seated Height-Max

1.72 mm

Telecom IC Type

TELECOM CIRCUIT

Features

Flame Retardant Coating, Safety

Height Seated (Max)

--

Width

9 mm

Length

9 mm