Microsemi Corporation W3H32M72E-400SBM

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

synthetic polyolefin

Number of Terminals

208

Diameter of protected wire (cable)

5.2…9.0 mm

Diameter before shrinkage

10.5 mm

Part Life Cycle Code

Transferred

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA, BGA208,11X19,40

Access Time-Max

0.6 ns

Clock Frequency-Max (fCLK)

200 MHz

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA208,11X19,40

Package Shape

RECTANGULAR

Package Style

GRID ARRAY

Supply Voltage-Nom (Vsup)

1.8 V

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

spool 100 m

ECCN Code

EAR99

Type

Heat shrink tubing without adhesive

Color

black

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.32.00.36

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B208

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

MILITARY

Supply Current-Max

1.7 mA

Organization

32MX72

Output Characteristics

3-STATE

Memory Width

72

Standby Current-Max

0.035 A

Memory Density

2415919104 bit

I/O Type

COMMON

Memory IC Type

DDR DRAM MODULE

Refresh Cycles

8192