Microsemi Corporation MMPQ2222A

Mounting Type

Surface Mount, Right Angle

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

Normal, Standard - Top

Number of Terminals

16

Transistor Element Material

SILICON

Exterior Housing Material

4

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Part Package Code

SOIC

Package Description

SOIC-16

Transmittance coefficient (transparency)

>92%

Surface hardness

>7

Positioning accuracy

<2 mm

Operating humidity

10%-90% 40°C

Operating voltage (controller)

12 V

Lifetime

50 million touches

Diagonal

21 inches

Operating load

30 g

Transport packaging size/quantity

66*21*49/5

Gross weight

2000.00

Transition Frequency-Nom (fT)

350 MHz

Package Style

SMALL OUTLINE

Package Shape

RECTANGULAR

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

150 °C

Operating temperature

-10°C - 60°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

JESD-609 Code

e0

Pbfree Code

No

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

ECCN Code

EAR99

Connector Type

Connector and Ejector

Number of Positions

9 (8 + 1)

Terminal Finish

TIN LEAD

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

not_compliant

Pin Count

a count of all of the component leads (or pins)

16

Contact Finish

Gold

JESD-30 Code

R-PDSO-G16

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Card Type

microSD™

Configuration

SEPARATE, 4 ELEMENTS

Interface

USB

Response time

<16 ms

Transistor Application

SWITCHING

Polarity/Channel Type

NPN

Resolution

4096 x 4096

Linearity

<1.5%

Collector Current-Max (IC)

0.5 A

DC Current Gain-Min (hFE)

40

Collector-Emitter Voltage-Max

40 V

Insertion, Removal Method

Push In, Pull Out

Features

Switch

Width

472 mm

Height

365 mm

Contact Finish Thickness

Flash

Height Above Board

0.055" (1.40mm)