Microsemi Corporation APTM50H14FT3G

Factory Lead Time

16 Weeks

Mount

Chassis Mount, Screw

Mounting Type

Chassis Mount

Package / Case

SP3

Number of Pins

32

Transistor Element Material

SILICON

Number of Elements

4

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

50 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2006

JESD-609 Code

e1

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

25

ECCN Code

EAR99

Terminal Finish

TIN SILVER COPPER

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AVALANCHE RATED

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

208W

Terminal Position

UPPER

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

UNSPECIFIED

Pin Count

a count of all of the component leads (or pins)

25

JESD-30 Code

R-XUFM-X25

Number of Channels

1

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

208W

Case Connection

ISOLATED

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

10 ns

FET Type

4 N-Channel (H-Bridge)

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

168m Ω @ 13A, 10V

Vgs(th) (Max) @ Id

5V @ 1mA

Input Capacitance (Ciss) (Max) @ Vds

3259pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

72nC @ 10V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

17ns

Drain to Source Voltage (Vdss)

500V

Fall Time (Typ)

41 ns

Continuous Drain Current (ID)

26A

Gate to Source Voltage (Vgs)

30V

DS Breakdown Voltage-Min

500V

FET Technology

METAL-OXIDE SEMICONDUCTOR

FET Feature

Standard

Height

11.5mm

Length

73.4mm

Width

40.8mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant