Microsemi Corporation A2F200M3F-1FG256I

Factory Lead Time

12 Weeks

Package / Case

256-LBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

256

Number of I/Os

MCU - 25, FPGA - 66

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~100°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

SmartFusion®

Published

2009

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

256

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

225

Supply Voltage

1.5V

Terminal Pitch

The center distance from one pole to the next.

1mm

Frequency

100MHz

Time@Peak Reflow Temperature-Max (s)

20

Base Part Number

A2F200

Number of Outputs

66

Supply Voltage-Max (Vsup)

1.575V

Supply Voltage-Min (Vsup)

1.425V

Interface

EBI/EMI, Ethernet, I2C, SPI, UART, USART

Operating Supply Current

3mA

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I2C, SPI, UART/USART

Architecture

MCU, FPGA

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Core Architecture

ARM

Number of Gates

The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

200000

Number of Logic Blocks (LABs)

8

Primary Attributes

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Flash Size

256KB

Length

17mm

Height Seated (Max)

1.7mm

Width

17mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant